Sonoscan Market Applications

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Market Applications
Sonoscan systems and SonoLab services are appropriate for a wide range of samples and needs, and are your best insurance against latent defects that may escape conventional testing methods. Applications include:
Microelectronics • Plastic Encapsulated IC • Ceramic Chip Capacitor • Die Attach, Chip-on-Board (COB) • Chip Scale Package (CSP) • Flip Chip • Stacked Die • Tape Automated Bond (TAB) • Hybrid, MCM, SIP • Flex Circuit • Printed Circuit Board (PCB) • Smart Card • Bonded Wafers • IMEMS	Micro Electromechanical Systems (MEMS) • Bonded Wafers • Fabrication Process Evaluation • Packaging Mil/Aero/Auto • High-Rel Qualification • Upscreening COTS • Qualification	Materials • Ceramic, Glass • Metal, Powdered Metal • Plastic • Composite Other • Lab-on-Chip, BioChip, Microarray • Filter Cartridge • Packaging, Seals • MicroFluidics • Poly/Foil Pouches • Weldments • Sensors
View a complete list of technical application notes showing examples of various defects, as well as optimal analysis techniques.