Sonoscan Acoustic Microscopy Market Applications

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Market Applications
Sonoscan systems and SonoLab services are appropriate for a wide range of samples and needs, and are your best insurance against latent defects that may escape conventional testing methods. Applications include:
Microelectronics • Plastic Encapsulated Microcircuits • Ceramic Chip Capacitors • Die Attach • Chip Scale Packages (CSPs) • Flip Chips • Stacked Dies • Ball Grid Arrays (BGAs/CBGAs) • Tape Automated Bond (TAB) • Hybrids, MCMs, SIPs • Flex Circuits • Printed Circuit Boards (PCBs) • Smart Cards • Bonded Wafers • Thermo Electric Coolers (TECs) • Power Modules Military, Aerospace, and Automotive • High-Rel Qualification • Upscreening COTS • Qualification • Lead Free Devices	Microelectromechanical Systems (MEMS) • Bonded Wafers • Fabrication Process Evaluation • Zero Level Packaging • Seal Integrity Evaluation • Packaging • Sensors • IMEMS • MOEMS • Lab-on-Chips • BioChips • Microarrays Composites • Fiberglass • Polymers • Graphite • Metal Matrix • Hybrid • Other	Materials • Glass • Ceramics • Plastics • Adhesives • Metals • X-ray Targets Solar Energy • Thin Film • Polymer-Based • Silicon Packaging, Seals • Food • Medical • Pharma • Other Hermetic Medical • Materials • Devices
View a complete list of technical application notes showing examples of various defects, as well as optimal analysis techniques.