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Plastic Encapsulated IC
• PLCC, PQFP, TSOP, SOIC, TQFP
• BGA, PBGA, CBGA
• J-STD-020, J-STD-035
• NASA: PEM-INST-001
Ceramic Chip Capacitor
• Discoidal, Filter, MLCC, etc.
• Mil-PRF-123, 31033 & 49470
Die Attach, Chip-on-Board (COB)
• Mil-STD-883–Method 2030
Chip Scale Package (CSP)
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Stacked Die
Tape Automated Bond (TAB)
• Mil-STD-883–Method 2035
Hybrid, MCM, SIP
Flex Circuit
Printed Circuit Board (PCB)
Smart Card
Bonded Wafers
• Direct, Anodic, Glass Frit, Intermediate layer
• J-STD-039
IMEMS
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PQFP
Optical and acoustic images showing popcorn crack defect |
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PQFP
Optical and acoustic images showing die
attach defects
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TSOP
Optical and acoustic images showing defects |
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PDIP Group
Optical and acoustic images showing defects |
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TQFP
Optical and acoustic images showing defects |
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TQFP Group
Optical and acoustic images showing defects in a JEDEC tray scan |
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PGA
Optical and acoustic images showing defects |
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Ceramic Chip Capacitors
Optical and acoustic images showing defects |
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Chip on Board (COB)
Optical and acoustic images showing die
attach defects |
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Smart Card
Optical and acoustic images showing die
crack defects |
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Smart Card
Optical and acoustic images showing demaminations |
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Flip Chip
Optical and acoustic images showing
underfill voids |
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Hybrid
Optical and acoustic images showing
underfill voids |
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Flex Circuit (BGA)
Optical and acoustic images showing
delaminations |
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PCB
Optical and acoustic images showing
defects on circuit board |
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Bonded Wafer
Optical and acoustic images showing voids |
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