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The AW™ Series are advanced high-capacity, high throughput, automated C-SAM® instruments specialized for maximum sensitivity for evaluation of wafer bond applications. The AW Series delivers a better than 5 micron sensitivity, throughputs that are approximately two times faster than competitive systems and non-immersion scanners that eliminate false positives due to DI water ingression. The AW Series automatically handles, inspects and sorts bonded wafers based on user-defined accept/reject criteria and are designed to handle wafers bonded by virtually any method, including direct fusion, anodic, glass frit and epoxy bonding.
The AW Series of instruments include:
AW200™ Series – Fully automated inspection of wafers 125mm to 200mm in diameter.
AW300™ Series – Dual loadports (optional), fully automated inspection of wafers 300mm in diameter. |
