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SonoLab applications personnel each have an average of more than ten years of experience in various industries, including microelectronics, materials, medical devices, pharmaceutical packaging and food packaging.
SonoLab’s integration of leading edge Sonoscan equipment with unmatched applications expertise has made SonoLab the recognized industry standard for nondestructive Acoustic Micro Imaging inspection services.
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Plastic Encapsulated IC
• PLCC, PQFP, TSOP, SOIC, TQFP
• BGA, PBGA, CBGA
• J-STD-020, J-STD-035
• NASA: PEM-INST-001
Ceramic Chip Capacitor
• Discoidal, Filter, MLCC, etc.
• Mil-PRF-123, 31033 & 49470
Die Attach, Chip-on-Board (COB)
• Mil-STD-883–Method 2030
Chip Scale Package (CSP)
Stacked Die
Tape Automated Bond (TAB)
• Mil-STD-883–Method 2035
Hybrid, MCM, SIP
Flex Circuit
Printed Circuit Board (PCB)
Smart Card
Bonded Wafers
• Direct, Anodic, Glass Frit, Intermediate layer
• J-STD-039
IMEMS
Bonded Wafers
Fabrication Process Evaluation
Packaging
• Zero Level
• Encapsulation
High-Rel Qualification
Upscreening COTS
Qualification
• J-STD-020 (Moisture/Reflow Classification)
• Mil-STD-883–Methods 2030 (Die Attach) & 2035 (TAB)
• Mil-PRF-123, 31033 & 49470 (Capacitors)
• NASA: PEM-INST-001
Ceramic, Glass
Metal, Powdered Metal
Plastic
Composite
Lab-on-Chip, BioChip, Microarray
Filter Cartridge
Packaging, Seals
MicroFluidics
Poly/Foil Pouches
Weldments
Sensors
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PQFP
Optical and Acoustic Example
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MEMS Wafer
Optical and Acoustic Example
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Foil Seal
Optical and Acoustic Example
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