Elk Grove Village IL, October. 27, 2006—Sonoscan has just shipped the first of its newest next-generation automated bonded wafer inspection systems to a Pacific Rim customer.
The new system uses ultra high frequency ultrasound to inspect the critical interface between 2 bonded wafers. If bonding is successful and uniform, and there are no defects, this interface is featureless in acoustic images. But voids, disbonds, cracks and solid particles that can cause failure in subsequent processing steps are sharply defined in the acoustic image.
Wafers of 6” and 8” diameters are handled by the new systems, which features a new robotic handler.
The system employs a very high-resolution ultrasonic transducer, and images anomalies down to 5 microns in diameter at the interface between the two wafers. The acoustic image made of each bonded wafer pair shows the whole wafer area, including any anomalies. The die pattern can be superimposed onto this image in order to match anomalies with individual die.
For more information, contact:
Robert Dranter, Vice President of Marketing
Sonoscan, Inc., 2149 East Pratt Blvd.
Elk Grove Village IL 60007
Phone 847 437-6400
E-mail: info@sonoscan.com
www.sonoscan.com
Photo caption: Acoustic image of the interface between two bonded wafers shows defects (white) over a range of sizes.
About Sonoscan: Sonoscan is the leading developer and manufacturer of acoustic microscopy systems, widely used for non-destructive imaging and analysis of internal features. For over 30 years, Sonoscan’s attention to customer needs and investment in R&D has created systems that set industry standards for accuracy. Key products include C-SAM® systems for off-line and laboratory work, and FACTS2™ for automated production inspection. Sonoscan engineers, with a total of more than two centuries’ experience in acoustic microscopy, conduct frequent workshops and seminars. SonoLab™, a division of Sonoscan, operates applications laboratories in 6 global locations.
