Plastic ICs/PEMs

0147  PQFP Die Cracks

0148  PQFP Die Attach

0202  PBGA 3D Acoustic Microscope Image

0206  PBGA 3D Cross-Sectioned Voids in Molding Compound

0210  PBGA 3D Sectioned Voids in Molding Compound

0245  PBGA Popcorn Crack

0299  PBGA Die Face Delaminations

0309  TSOP Die Cracks

0434  PQFPs Production Scanning

0759  TSOP Cracked Die

1009  PBGA Delaminations, Through Transmission

1011  PBGA Delaminations

1012  PBGA Popcorn Crack, Through Transmission

1020  Chip On Board Voids

1021  Chip On Board Voids, Through Transmission

1053  PDIP Lead Delaminations on Top

1054  PDIP Lead Delaminations on Bottom

1058  PLCC Lead Delaminations

1148  PQFP Heat Damage

1086  SOIC Die and Lead Delamination

2250  SOJ Lead and Paddle Delaminations

2515  Plastic Encapsulated Microcircuit (PEM) 3D Acoustic Microscope Image

2518  QFN Lead Delaminations

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Flex Circuit

0053  Flex Circuit Delaminations

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Smart Card

0304  Smart Card Induction Coil

0305  Smart Card Induction Coil Defects

0306  Smart Card Cracked Die

0452  Smart Card 3D Acoustic Microscope Image

0453  Smart Card 3D Acoustic Microscope Image Sectioned

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Bonded Wafers

0419  Bonded Wafer Delaminations and Voids

2575  Bonded Wafer Delaminations Caused by Contamination

2581  Bonded Wafer with Multiple Voids

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Chip Scale Package

0540  CSP Delamination

0543  CSP Voids

0620  CSP Die Face

0657  CSP Die Attach Delamination, Through Transmission

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Flip Chip

0354  Flip Chip - Disbonded solder bumps and halo defects

0355  Flip Chip Heat Sink Attach

1016  Flip Chip Underfill Void and Solder Bump Defects

2271  Flip Chip Underfill Void

2466  Flip Chip Underfill Multiple Voids

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Hybrid

1046  Multi Chip Module (MCM) Die Attach Defects

1066  Multi Chip Module (MCM) Direct Bond Copper Defects

2596  Plastic BGA

2600  PBGA MC to Substrate Delamination

2602  PBGA Virtual Cross-Section

2614  Plastic BGA

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Ceramic

2082  Ceramic Chip Capacitor Voids and Delaminations

2083  Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section

2187  Ceramic Disc Voids

2417  Ceramic Chip Capacitor Large Voids

2470  Ceramic Cutting Tool Voids and Cracks

2641  PBGA 3D Substrate Delamination

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Solar Cells

0900  Solar Panel Delaminations and Cracks

0901  Solar Cell to Metal Buss Bar Delaminations

0902  Solar Cell Buss Bar to Connector Box Defects

0903  Solar Cell to Patterned Metal Buss Bar Delaminations

0904  Solar Cell Concentrator Delaminations

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Packaging, Seals

0800  Blister Pack Seal Voiding, Through Transmission

0801  Polymer Pouch Seal Integrity, Through Transmission

0802  Polymer Tub Seal Integrity

0810  Polymer Pouch Seal Voids, Through Transmission

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Materials

1200  Titanium Bar Material Voids

1202  Molybdenum Plate Material Voiding

1203  Ceramic Material Voids and Virtual Cross-Section

1204  Polymer Coating to Aluminum Plate Delamination

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2158  Microfluidics Channel Defects

2299  Heat Sink to PCB Bond Defects

2479  PCB Internal Layers

2543  Diagnostic Medical Device PCB Interface Delaminations