Sonoscan Application Notes

Application Notes

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Plastic ICs/PEMs
0147 PQFP: Die cracks and small delaminations
0148 PQFP: Die attach delaminations
0202 PBGA: Acoustic Solid: unsectioned using 3V and Zip-Slice
0206 PBGA: Acoustic Solid: voids in molding compound using 3V and Zip-Slice
0210 PBGA: Acoustic Solid: voids in molding compound using 3V and Zip-Slice
0245 PBGA - Delaminations and popcorn crack
0299 PBGA - Die face delaminations
0309 TSOP - Die cracks
0434 PQFP: Tray screening on the the FACTS2 instrument
0759 TSOP - Cracked die
1009 PBGA - Large delaminations detected using the Thru-scan mode
1011 PBGA - Delaminations
1012 PBGA - Delaminations and popcorn crack using the Thru-scan mode
1020 Chip On Board - Voids
1021 Chip On Board - Thru-scan mode confirmation of voids
1053 PDIP: Delaminations on the top side
1054 PDIP: Delaminations on the back side
1058 PLCC: Delaminations along leads
1148 PQFP: Simulated heat of lead-free processing
1086 SOIC - Die face and lead finger delamination
2039 Plastic IC packages (TSOPs), FACTS2 automated system
2250 Plastic IC package (SOJ)
2515 Plastic encapsulated IC
2518 QFNs
2521 Small Outline Transistors
2535 Plastic BGA, voids
2566 TQFP

Flex Circuit
0053 Flex circuit - Delamination of flex from stiffener; die attach disbond

Smart Card
0304 Smart card: Induction coil and bond pads - no defects
0305 Smart card: Induction coil and bond pads - defects
0306 Smart card: Cracked die
0452 Smart card: No defects using Zip slice and 3V
0453 Smart card: Internal defects using Zip slice and 3V

Bonded Wafers
0419 Bonded wafer pair - delaminations and voids
2575 Bonded silicon wafer pair
2581 Bonded silicon wafer pair

Chip Scale Package
0540 Chip Scale package - massive internal delamination
0543 Chip Scale package - small voids
0620 Chip Scale package - die face
0657 Chip Scale package - die attach delamination

Flip Chip
0354 Flip Chip - Disbonded solder bumps and halo defects
0355 Flip Chip - Heat sink and adhesive
1016 Flip Chip - Solder ball disbonds and missing (voided) underfill
2271 Flip Chip
2466 Flip Chip, voids in underfill

Hybrid
1046 Multi Chip Module - Surface scan and die attach
1066 Rectifier: Bonding of Copper Base to Ceramic Substrate
2596 Plastic BGA
2600 Plastic BGA
2602 Plastic BGA
2614 Plastic BGA

Ceramic
2082 Multi-layer ceramic chip capacitors
2083 Multi-layer ceramic chip capacitor
2187 High-performance ceramic disk
2417 Multi-layer ceramic chip capacitor
2470 Tungsten carbide disk
2641 Plastic BGA, large delamination

Other
2158 Microfluidics lab-on-a-chip
2299 Heat sink on single-sided PC board
2479 Printed Circuit Board
2543 Diagnostic medical device

Microelectronics

MEMS

Mil/Aero/Auto

Materials

Other Applications