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Home > Resources > Application Notes > Application Note 210
Application Note #210 – Plastic Ball Grid Array (PBGA)
Acoustic solid: voids in molding compound 3V™ and Zip Slice™

Acoustic image left, optical image of PGBA middle, diagram right

Sample & Method

The Acoustic Solid shown in Application Notes #202 and #206 has been sectioned in two geometric planes to reveal the die attach region and other internal features.

Result

The die attach region (square blue area) shows some differences in acoustic intensity (light and dark blue), indicating variations in the die attach. The numerous small voids (yellow) in the molding compound, seen in Application Note #206, are also seen here.

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