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A Plastic-packaged BGA was imaged. Gating was on the interface between the molding compound and the die face. The die in this package is positioned with the active side upwards.
• Red areas along the die face are delaminations of the molding compound from the die face. Die face delaminations
are a threat to reliability because they can expand during use until they shear off bond wires.
• The smaller red areas just outside the periphery of the die show delamination between the interconnect wires and
mold compound. Delamination in this region can allow for moisture to collect leading to corrosion of the wires.
• In the non-defect (gray) regions, C-SAM is so sensitive that it images the distribution of the filler particles in the
molding compound. |
