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Home > Resources > Application Notes > Application Note 305
Application Note #0305 – Smart Card
Induction Coil and Bond Pads - Defects

Acoustic image left, showing delaminations (black areas)
Sample & Method

A non-contact style Smart Card was imaged on C-SAM to look for potential defects along the section of the induction coil running near the bond pads.

Result

Delaminations (black areas) are visible at several points along the induction coil.  In addition, the wire bonds do not appear to be bonded to their pads. 

Microelectronics

MEMS

Mil/Aero/Auto

Materials

Other Applications