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Acoustic image left, showing a cracked die |
A region of a non-contact style Smart Card was imaged on C-SAM from the die face side of the card.
• The die in this Smart card has been cracked and the symmetry of the crack suggests that the cracking occurred as a
• result of improper handling during assembly.
• Acoustically, die cracks are, like many internal defects, gap-type defects. Unlike many other defects die cracks are
usually vertical.
• Die in numerous package types sometimes show smaller cracks, often as small, thin acoustic features. It is not
uncommon for packages having small cracks to pass the manufacturer's electrical tests, since the crack has not yet had
time to expand to the point where it will reach and disrupt the active circuitry on the face of the die. |
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