Sonoscan Application Note 453

No Defects using Zip Slice™ and 3V™

3D Acoustic image of a smart card, Optical image

The sample is the same contact-type smart card shown in Application Note # 452. Here, 3V software has been used to section the Acoustic Solid representing the smart card. Sectioning is geometric; a 3-dimensional corner has been removed to reveal the die attach and the bond pads. 3V sectioning may also be done by removing individual slices or according to the acoustic properties of materials.

Result

The die attach area shows some non-uniformity that is probably not a reliability concern. Similar non-uniformity would be more serious in a device exposed to thermal cycling. The second bond pad from the left, however, appears to have no wire bonded to it.