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Home > Resources > Application Notes > Application Note 759
Application Note #759 – Thin Small Outline Package (TSOP)
Cracked die

Optical image of a TSOP, Full JEDEC tray, Acoustic Image showing zoomed area of JEDEC tray
Sample & Method

JEDEC trays of plastic TSOPs were imaged with the automated FACTS2 system (top right image). Each tray held 60 devices. Gating was on the die.

Result

There are no molding compound to die surface delaminations in the samples. However, many die are cracked at the mid-point (dark vertical line), probably as a result of improper handling. The magnified portion of the whole-tray image shows the details.

Microelectronics

MEMS

Mil/Aero/Auto

Materials

Other Applications