Sonoscan Application Note 1011

Delaminations

The same plastic BGA packages shown in Note #1012 were imaged in reflection mode by C-SAM at 15 MHz. Gating was on the interface between the molding compound and the substrate.

Result

The two packages at top have no significant internal defects. The package at lower left has a very large area of delamination (white area on substrate). In the package at lower right, there are smaller but significant areas of delamination/cracks around three sides of the die.

Microelectronics

MEMS

Mil/Aero/Auto

Materials

Other Applications