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Home > Resources > Application Notes > PDIP Lead Delaminations on Top
PDIP Lead Delaminations on Top
Application Note 1053
Lead Delaminations
Acoustic image of a PDIP showing delaminations (red) center
Sample & Method

This PDIP (Plastic Dual In-line Package) was imaged at 15 MHz from the back side of the package. Gating was on the interface between the molding compound and the lead frame and paddle.

Result

The small red areas are delaminations between the back side of the lead fingers and the molding compound. Delaminations in these areas encourage the collection of moisture and contaminants and the initiation of corrosion.
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