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Home > Resources > Application Notes > Application Note 1053
Application Note #1053 – PDIP
Delaminations on the back side

Acoustic image of a PDIP showing delaminations (red) center
Sample & Method

This PDIP (Plastic Dual In-line Package) was imaged at 15 MHz from the back side of the package. Gating was on the interface between the molding compound and the lead frame and paddle.

Result

The small red areas are delaminations between the back side of the lead fingers and the molding compound. Delaminations in these areas encourage the collection of moisture and contaminants and the initiation of corrosion.

Microelectronics

MEMS

Mil/Aero/Auto

Materials

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