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Home > Resources > Application Notes > Application Note 2581
Application Note #2581Bonded Silicon Wafer
Multiple Voids

Sample & Method

Two silicon wafers, bonded together.  Echoes were gated at the depth of the bond between the two wafers.

Result

The numerous dark circular features are voids at the interface between the wafers. Circular voids are often caused by very tiny particles of SiO2 or other solid contaminants

Microelectronics

MEMS

Mil/Aero/Auto

Materials

Other Applications