Acoustic Microscopy Image Multi Chip Module (MCM) Die Attach Defects

Application Note 1046

Acoustic die attach level scans

A surface acoustic scan was performed of the entire MCM for reference. A surface scan uses only the first return echo, with minimal penetration into the sample. Individual components were then scanned at the die attach depth using a 230 MHz transducer.

Result

All three scanned components showed massive voids (red) within the die attach material.

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