Sonoscan
Home | About Us | Careers | Contact | InstaQuote | Tech Support  |      
Publications
Industry Standards
Links
AMI Glossary
FAQs
Technical Updates
Application Notes
Home > Resources > Application Notes > PBGA 3D Cross-Sectioned Voids in Molding Compound
PBGA 3D Cross-Sectioned Voids in Molding Compound
Application Note 206
PBGA Cross Section Voids
Acoustic image left, optical image of PGBA middle, diagram right
Sample & Method

The Acoustic Solid shown in Application Note #202 has been sectioned vertically to reveal internal features. Since the Acoustic Solid is a virtual representation of the PBGA, including all internal features, sectioning is nondestructive.

Result

The die (blue) lies at the center of the package near the bottom. To the left and right of the die is the FR4 substrate (also blue). No defects are associated with these features.  The molding compound above these features, however, displays numerous yellow items. These are voids in the molding compound. A few of the larger voids are blue. 
Free Sample Analysis

Applications