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Microelectronics - Bonded Wafer
Microelectronics - Ceramic Chip Capacitor
Microelectronics - Chip Scale Package
Microelectronics - Flip Chip
Microelectronics - Hybrid/MCM/SIP
Microelectronics - Plastic IC Packaging/PEM
Microelectronics - Plastic IC Packaging/PEM/BGA
Microelectronics - Printed Circuit Board
Microelectronics - Smart Card
Microelectronics - Stacked Die
Materials - Composite |
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| Microelectronics - Bonded Wafer |
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at Pan Pac January-02
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Development of a Resolution Test Wafer for Use in Acoustic Microscopy of Microelectronic Devices (PDF)
As Presented at Pan Pac January-04 |
Early Boost to Yields (PDF)
As Published in European Semiconductor September-01 |
Checking for Wafer-to-Wafer Bonding Integrity (PDF)
As Published in Electronics Engineer December-99 |
Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-01 |
Management of Voids in Processing of Bonded Wafers (PDF)
As Published in Sonoscan White Paper October-02 |
Checking for Wafer-to-Wafer Bonding Integrity (PDF)
As Published in Electronics Engineer December-99 |
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| Microelectronics - Ceramic Chip Capacitor |
Acoustic Inspection of Square-Section Capacitors (PDF)
As Published in Passive Component January/February 2007 |
Achieving Long-Term Reliability in Chip Capacitors (PDF)
As Published in Evaluation Engineer November-01 |
Acoustic Imaging of Capacitor Cracks Caused at Singulation (Korean Language) (PDF)
As Presented at SMT Korea November-06 |
Acoustic Imaging and Screening of Ceramic Chip Capacitors (PDF)
As Presented at Passive Component Industry August-02
Shadows Indicate Cracks (PDF)
As Published in EPP Europe May/June-07 |
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| Microelectronics - Chip Scale Package |
Chip-Scale Packages: Inspection Methods for Diverse Designs (PDF)
As Published in Electronics Engineer Nov-97 |
CSP and Micro-BGA Process and Damage Assessment with Acoustic Micro Imaging (PDF)
As Presented at SMTA September-00 |
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| Microelectronics - Flip Chip |
Optimizing Processes and Materials for Flip Chip Reliability (PDF)
As Published in Circuits Assembly February-04 |
Evaluation Of Underfill In Flip Chip And BGA On PC Boards Using 3v Reconstruction, Through Transmission Imaging (PDF)
As Presented at Pan Pac January-00 |
Characterization of Flip Chip Bump Failure Modes Using High Frequency Acoustic Micro Imaging (PDF)
As Presented at Interconnection June-97 |
Characterization of Flip Chip Interconnect Failure Modes Using High Frequency AMI with Correlative Analysis (PDF)
As Presented at IRPS April-97 |
Diagnosing and Avoiding Flip Chip Packaging Defects (PDF)
As Published in Evaluation Engineer November-01 |
Flip Chips and AMI: An Overview of Past Applications, Present Status, and Roadmap for the Future (PDF)
As Presented at ESREF October-00 |
High Frequency AMI for Process Monitoring and Quality Control in Flip Chip Underfill Assembly (PDF)
As Presented at APEX March-00 |
Flip Chips and AMI: An Overview of Past Applications, Present Status, And Roadmap for the Future (PDF)
As Presented at IAMIS March-00 |
Evaluation of Chip Scale Packaging Using AMI: An Overview of Applications, Limitations and Directions for Future Developments (PDF)
As Presented at Pan Pac January-98 |
Flip Chips and AMI: An Overview of Past Applications, Present Status, And Roadmap for the Future (PDF)
As Presented at SMTA September-00 |
Cleaning Up the Flip-Chip Production Act (PDF)
As Published in Printed Circuit Fabrication May-01 |
Cleaning Up the Flip-Chip Production Act (PDF)
As Published in Printed Circuit Fabrication January-01 |
Preventing Flip-Chip Solder Joint Failures (PDF)
As Published in High-Density Interconnect June-01 |
Flip Chip Solder Joint Failures (PDF)
As Published in High-Density Interconnect January-01 |
Preventing Flip-Chip Solder Joint Failures (PDF)
As Published in High-Density Interconnect August-01 |
In Situ Elastic Property Characterization of Flip-Chip Underfills (PDF)
As Presented at IEPS May-98 |
Exploring the Flip Chip to Achieve High Reliability (PDF)
As Published in Medical Electronics Manufacturing October-00 |
Metrology of Thin Layers in IC Packages Using an Acoustic Microprobe: Bondline Thickness (PDF)
As Presented at ECTC June-99 |
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at PanPac January-02 |
Application Of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films (PDF)
As Presented at Pan Pac January-99 |
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI (PDF)
As Presented at SMTAI September-03 |
Analysis of a Previously Shipped Part - The Virtual Sample (PDF)
Sonoscan White Paper February-02
Nondestructive Bondline Measurement in Advanced Flip Chips (PDF)
As published on www.ap.pennnet.com, Advanced Packaging Industry News January-08
Method for Automated Nondestructive Analysis of Flip Chip Underfill (PDF)
As distributed at the International Conference on Soldering and Reliability May-08 |
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| Microelectronics - Hybrid/MCM/SIP |
Acoustic Microscopy Analysis of Die Attached for Satellite Applications (PDF)
As Presented at ASNT June-97 |
Acoustic Evaluation of Heat Sink Attachment (PDF)
As Published in Power Systems Design Europe February-04 |
Application of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films (PDF)
As Presented at Pan Pac January-99 |
Using Acoustic Micro Imaging to Inspect MCMS (PDF)
As Published in Electronics Engineer April-96 |
Quality Assurance for Multichip Modules with AMI Techniques (PDF)
As Presented at Euro ISHM October-98 |
Capabilities of Acoustic Micro Imaging (AMI) For Opto-Electronic Packaging (PDF)
As Presented at Opto October-03 |
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI (PDF)
As Presented at SMTAI September-03
Nondestructive Bondline Measurement in Advanced Flip Chips (PDF)
As published on www.ap.pennnet.com, Advanced Packaging Industry News January-08 |
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| Microelectronics - Plastic IC Packaging/PEM |
Identifying IC Package Anomalies with Acoustic Solids (PDF)
As Published in Electronics Engineer January-99 |
Removing Hidden Internal Packaging Defects from Production (PDF)
As Published in US Tech Nov/Dec-99 |
The Moisture Sensitivity Standard Goes Pb-Free (PDF)
As Published in Circuits Assembly January-07 |
Nondestructive Elastic Property Characterization of IC Encapsulants (PDF)
As Presented at ASME IMECE November-97 |
Acoustic Micro Imaging Finds Hidden Defects (PDF)
As Published in US Tech January-01 |
Systems Designers Should Take Care when Specifying Plastic Parts in Military Electronics. (PDF)
As Published in Military Aerospace August-00 |
Systems Designers Should Take Care when Specifying Plastic Parts in Military Electronics. (PDF)
As Published in Military Aerospace November-99 |
Towards a Nondestructive Procedure for Characterization of Molding Compounds (PDF)
As Presented at IRPS October-97 |
Evaluation of Thin Plastic Packages Using Acoustic Micro Imaging (PDF)
As Presented at Semi Test August-96 |
Reclamation Keeps the Wheel Turning (PDF)
As Presented at EPP Europe February-04 |
Case Studies In the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability Applications (PDF)
As Presented at SMTAI September-03 |
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI (PDF)
As Presented at SMTAI September-03 |
Evaluation of Pb-Free TSOP Devices (Korean Language) (PDF)
As Presented at SMT Korea October-04 |
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Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac February-05 |
Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-05
Acoustic Detection of Package Contamination (PDF)
As Published in Semiconductor International April-07 |
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| Microelectronics - Plastic IC Packaging/PEM/BGA |
Identifying IC Package Anomalies with Acoustic Solids (PDF)
As Published in Electronics Engineer January-99 |
Analysis of BGA and Other Area Array Packaging Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-96 |
Evaluation of Underfill In Flip Chip and BGA On PC Boards Using 3v Reconstruction And Through Transmission
Imaging (PDF)
As Presented at Pan Pac January-00 |
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at Pan Pac January-02 |
Swift Acoustic Inspection Rescues BGAs (PDF)
As Presented at EP&P October-02 |
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| Microelectronics - Printed Circuit Board |
Evaluation of Underfill in Flip Chip and BGA on PC Boards Using 3v Reconstruction and Through Transmission
Imaging (PDF)
As Presented at Pan Pac January-00 |
Acoustic Tools and Applications for PCB Inspection (PDF)
As Published in EP&P November-01 |
Acoustic Micro Imaging Finds Hidden Defects (PDF)
As Published in US Tech January-01 |
Case Studies in the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability (High-Rel) Applications (PDF)
As Presented at SMTAI September-03 |
An Overview of Solder Bond Evaluation in Electronics Applications Using Acoustic Micro Imaging (PDF)
As Presented at Afeit-Brasage September-01 |
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| Microelectronics - Smart Card |
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Acoustic Imaging of Embedded ICS (PDF)
As Published in SMT January-07 |
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| Microelectronics - Stacked Die |
Acoustic Micro Imaging of a Stacked Die (PDF)
As Published in Semiconductor Int’l June-05
Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-05
Update on the Evaluation of Stacked Die Packages Using Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January-08 |
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| Materials - Composite |
Acoustic Verification of Composites (PDF)
As Published in AMP March-07 |
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