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Home > Resources > Application Notes > Chip On Board Voids, Through Transmission
Chip On Board Voids, Through Transmission
Application Note 1021
Voids Through Transmission
Acoustic image of a COB revealing a darker area at the bottom edge which is a void
Sample & Method

This COB (also shown above) was imaged by THRU-Scan at an ultrasonic frequency of 15 MHz. THRU-Scan uses a second transducer positioned below the sample that collects ultrasound that has penetrated the entire thickness of the sample. In this sample, since the device was mounted on a board, ultrasound traveled through both the device and the board for imaging.

Result

The dark area along the bottom edge of the die is the void.
Free Sample Analysis

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