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AMI Overview
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Identified Defects (gif)

The Value of C-SAM® Acoustic Micro Imaging (AMI)

Accurate and Non-destructive
Through the use of ultra-high frequency ultrasound, AMI non-destructively finds and characterizes physical defects—such as cracks, voids, delaminations and porosity— that occur during manufacturing, environmental testing or even under normal component operation. Because of the unique aspects of the technology, AMI can locate these defects better than any other inspection method.
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