Sonoscan Free Seminar Registration

Free Seminar Registration

Learn How Acoustic Micro Imaging Improves Component Reliability

Contact Information
First Name:
Last Name:
Title:
Company:
Address1:
Address2:
City
State:
Zip:
Country:
Phone:	- -
Cell Phone:	- -
Fax:	- -
Email:

Seminar Location:
Date:
Time:
I would like to submit samples for evaluation during the demonstration
My defect detection interests are:
	Flip chip Interconnection, DCA, CSP:
	Plastic IC Packages, JEDEC Qualification:
	Multi-Chip Modules/Surface Mount Components:
	Ceramic Capacitor, Lot Qualification
	Hybrids, Characterization and Bonding
	Materials Characterization and Bonding
	Other: (please explain)

I would like to receive bi-monthly technical updates via email
I can not attend, but I would like to discuss inspection issues with an application engineer