Sonoscan Free Seminar Registration

Training Workshop Registration

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My defect detection interests are:
	Flip chip Interconnection, DCA, CSP:
	Plastic IC Packages, JEDEC Qualification:
	Multi-Chip Modules/Surface Mount Components:
	Ceramic Capacitor, Lot Qualification
	Hybrids, Characterization and Bonding
	Materials Characterization and Bonding
	Other: (please explain)

I would like to receive bi-monthly technical updates via email
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